DE · Topics · Resources

Digital Engineering July/August 2023

The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.

August 1, 2023

Inside This Issue:

Subscription-Based Software: The New Normal?

Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.  

SaaS Gains Ground in ECAD 

Simulation drives ECAD to subscription.

Playful Magic and Functional Esthetics

Incorporating electronics to raise the bar for toys and accessories. 

How Well Can PLM Support Electronics Developers?

Until now, PLM has made limited inroads into the electronics design and development sector.

Production-grade AM Gets Quality Boost 

Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing  part quality, but more work needs to be done.

Choosing the Right Computing Options for Enhanced Workflows

Getting the ideal hardware for your engineering applications isn’t just about the price tag.

Top Performance Winner: BOXX APEXX S3

The latest workstation from BOXX beats the performance of its predecessor.

Download today

Latest News

Indy Autonomous Challenge to Returns to Indianapolis Speedway
Race set to feature a head-to-head race of possibly the fastest autonomous racecars piloted by artificial intelligence driver software, organizers...

Desktop Metal Releases Binder Jet 3D Printing Upgrade
The Production System P-1 metal binder jet 3D printer will be offered with a Reactive Safety Kit for high-speed production...

MathWorks Advances Software-Defined Workflows with NVIDIA’s Help
Developers can use their existing MATLAB Algorithm Codebase to develop and deploy AI-enabled applications via the NVIDIA Holoscan platform.

AI in Design: In Need of New Hardware
New hardware options are emerging to support artificial intelligence use cases.

Can AI Eat Itself?
Looks like synthetic training data is here to stay—it's something engineering organizations should keep a close eye on.

Sustainable Packaging Requires an Innovative Data-Driven Ecosystem 
Sustainable packaging is a complex challenge that cuts across several evolving manufacturing developments.

All posts