HPC: When to Make Your Move

5 ways to know it's time to change your computing workflow.

Increasing product complexity is fueling the need for a far more sophisticated, digital design environment that demands levels of processing power and collaborative workflows beyond the capacity of yesterday’s engineering workstations.

Everything from modern-day household appliances, to consumer electronics, to industrial machinery and automobiles are being stacked with mechanical assemblies, electrical systems and embedded software that rival historically more robust offerings. The incoming connected product generation is even more complex, incorporating a bounty of sensors, wireless communications modules and machine learning capabilities. Manufacturers are scrambling to produce more sophisticated offerings in less time and at lower costs. The only way they can do so effectively is by harnessing digital prototyping tools and simulation-driven design practices that allow for concepts to be iterated and tested in a virtual world, which is much less expensive and time-consuming than building and testing physical prototypes.

While optimizing and testing product designs virtually is the surest route to best- in-class products, they also require more computing power than ever before. Complex CAD models, large-scale simulations, and realistic visualization and graphics capabilities are taxing existing workstations, many of which are already operating at or beyond peak capacity. IT administrators, under pressure from the engineering ranks for high- performance computing (HPC) solutions, are trying to determine the right time to upgrade and which HPC model makes the most sense. 

Download this paper to learn more.

Fill out the information below to download the resource.

By downloading this content, I agree to receive the DE 24/7 Newswire, a twice weekly free email newsletter (you may choose to opt-out in the newsletter).

Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

All posts