Digital Engineering July/August 2023

The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.

Inside This Issue:

Subscription-Based Software: The New Normal?

Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.  

SaaS Gains Ground in ECAD 

Simulation drives ECAD to subscription.

Playful Magic and Functional Esthetics

Incorporating electronics to raise the bar for toys and accessories. 

How Well Can PLM Support Electronics Developers?

Until now, PLM has made limited inroads into the electronics design and development sector.

Production-grade AM Gets Quality Boost 

Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing  part quality, but more work needs to be done.

Choosing the Right Computing Options for Enhanced Workflows

Getting the ideal hardware for your engineering applications isn’t just about the price tag.

Top Performance Winner: BOXX APEXX S3

The latest workstation from BOXX beats the performance of its predecessor.

Download today

Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

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